Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734247 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2020-08-04 |
| 10707161 | Cavity wall structure for semiconductor packaging | Hua Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Somsak Phukronghin, Paweena Phatto | 2020-07-07 |
| 10658277 | Semiconductor package with a heat spreader and method of manufacturing thereof | Antonio B. Dimaano, Jr., Nataporn Charusabha, Preecha Joymak, Roel Adeva Robles | 2020-05-19 |
| 10600741 | Semiconductor package with plated metal shielding and a method thereof | Suebphong Yenrudee, Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan | 2020-03-24 |
| 10586771 | Conductive shield for semiconductor package | Somchai Nondhasitthichail | 2020-03-10 |