Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600741 | Semiconductor package with plated metal shielding and a method thereof | Suebphong Yenrudee, Chanapat Kongpoung, Siriwanna Ounkaew, Chatchawan Injan, Saravuth Sirinorakul | 2020-03-24 |