Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734247 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Saravuth Sirinorakul | 2020-08-04 |
| 10600741 | Semiconductor package with plated metal shielding and a method thereof | Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan, Saravuth Sirinorakul | 2020-03-24 |