Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847495 | Bonding system and bonding method | Hiroshi Maeda, Kenji Sugakawa | 2020-11-24 |
| 10801977 | Radiation analyzing apparatus and radiation analyzing method | Satoshi Nakayama, Keiichi Tanaka, Kazuo Chinone | 2020-10-13 |