Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847495 | Bonding system and bonding method | Atsushi Nagata, Kenji Sugakawa | 2020-11-24 |
| 10747203 | Modeling process device, modeling process system, and medium | Reiji Yukumoto, Koji Kobayashi, Yasuaki YUJI, Fei Yang | 2020-08-18 |