Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796956 | Contact fabrication to mitigate undercut | Nazila Dadvand, Christopher Daniel Manack | 2020-10-06 |
| 10734304 | Plating for thermal management | Nazila Dadvand, Christopher Daniel Manack | 2020-08-04 |
| 10692830 | Multilayers of nickel alloys as diffusion barrier layers | Nazila Dadvand, Christopher Daniel Manack | 2020-06-23 |
| 10629334 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Christopher Daniel Manack | 2020-04-21 |
| 10566267 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Nazila Dadvand | 2020-02-18 |