Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840211 | Semiconductor package with leadframe having pre-singulated leads or lead terminals | Bradley Glasscock, Michael Todd Wyant | 2020-11-17 |
| 10833036 | Interconnect for electronic device | Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal | 2020-11-10 |
| 10796956 | Contact fabrication to mitigate undercut | Nazila Dadvand, Salvatore Frank Pavone | 2020-10-06 |
| 10734304 | Plating for thermal management | Nazila Dadvand, Salvatore Frank Pavone | 2020-08-04 |
| 10714417 | Semiconductor device with electroplated die attach | Nazila Dadvand | 2020-07-14 |
| 10692830 | Multilayers of nickel alloys as diffusion barrier layers | Nazila Dadvand, Salvatore Frank Pavone | 2020-06-23 |
| 10629334 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Salvatore Frank Pavone | 2020-04-21 |
| 10607931 | Semiconductor device with electroplated die attach | Nazila Dadvand | 2020-03-31 |
| 10566267 | Die attach surface copper layer with protective layer for microelectronic devices | Nazila Dadvand, Salvatore Frank Pavone | 2020-02-18 |