| 10840211 |
Semiconductor package with leadframe having pre-singulated leads or lead terminals |
Bradley Glasscock, Michael Todd Wyant |
2020-11-17 |
| 10833036 |
Interconnect for electronic device |
Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal |
2020-11-10 |
| 10796956 |
Contact fabrication to mitigate undercut |
Nazila Dadvand, Salvatore Frank Pavone |
2020-10-06 |
| 10734304 |
Plating for thermal management |
Nazila Dadvand, Salvatore Frank Pavone |
2020-08-04 |
| 10714417 |
Semiconductor device with electroplated die attach |
Nazila Dadvand |
2020-07-14 |
| 10692830 |
Multilayers of nickel alloys as diffusion barrier layers |
Nazila Dadvand, Salvatore Frank Pavone |
2020-06-23 |
| 10629334 |
Nanostructure barrier for copper wire bonding |
Nazila Dadvand, Salvatore Frank Pavone |
2020-04-21 |
| 10607931 |
Semiconductor device with electroplated die attach |
Nazila Dadvand |
2020-03-31 |
| 10566267 |
Die attach surface copper layer with protective layer for microelectronic devices |
Nazila Dadvand, Salvatore Frank Pavone |
2020-02-18 |