Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840185 | Semiconductor device with vias having a zinc-second metal-copper composite layer | — | 2020-11-17 |
| 10832993 | Packaged multichip device with stacked die having a metal die attach | Sreenivasan K. Koduri, Benjamin Stassen Cook | 2020-11-10 |
| 10832991 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Sreenivasan K. Koduri | 2020-11-10 |
| 10804201 | Dissimilar material interface having lattices | Archana Venugopal, Benjamin Stassen Cook, Luigi Colombo | 2020-10-13 |
| 10796956 | Contact fabrication to mitigate undercut | Christopher Daniel Manack, Salvatore Frank Pavone | 2020-10-06 |
| 10748999 | Multi-super lattice for switchable arrays | Benjamin Stassen Cook, Luigi Colombo, Archana Venugopal | 2020-08-18 |
| 10734304 | Plating for thermal management | Christopher Daniel Manack, Salvatore Frank Pavone | 2020-08-04 |
| 10714439 | Electronic device having cobalt coated aluminum contact pads | Helmut Rinck | 2020-07-14 |
| 10714417 | Semiconductor device with electroplated die attach | Christopher Daniel Manack | 2020-07-14 |
| 10692830 | Multilayers of nickel alloys as diffusion barrier layers | Christopher Daniel Manack, Salvatore Frank Pavone | 2020-06-23 |
| 10676828 | Conversion coating and method of making | Nafih Mekhilef, Yi Jiang, Raymond J. White | 2020-06-09 |
| 10629334 | Nanostructure barrier for copper wire bonding | Christopher Daniel Manack, Salvatore Frank Pavone | 2020-04-21 |
| 10607931 | Semiconductor device with electroplated die attach | Christopher Daniel Manack | 2020-03-31 |
| 10584231 | Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof | Nabil Nahas | 2020-03-10 |
| 10566267 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Salvatore Frank Pavone | 2020-02-18 |
| 10544034 | Nickel lanthanide alloys for mems packaging applications | Kathryn Ann Schuck | 2020-01-28 |