Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870151 | Structure and method for sealing through-hole, and transfer substrate for sealing through-hole | Toshinori Ogashiwa, Yuya Sasaki, Kenichi Inoue | 2020-12-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870151 | Structure and method for sealing through-hole, and transfer substrate for sealing through-hole | Toshinori Ogashiwa, Yuya Sasaki, Kenichi Inoue | 2020-12-22 |