Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870151 | Structure and method for sealing through-hole, and transfer substrate for sealing through-hole | Toshinori Ogashiwa, Yuya Sasaki, Masayuki Miyairi | 2020-12-22 |
| 10858295 | Composite particles, composite powder, method for manufacturing composite particles, and method for manufacturing composite member | Shuho Koseki, Tadashi Furuya, Daiki Shinno | 2020-12-08 |
| 10828702 | Silver powder and method for producing same | Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida | 2020-11-10 |
| 10773311 | Phosphorus-containing copper powder and method for producing the same | Atsushi Ebara, Masahiro Yoshida, Kyoso MASUDA, Takahiro Yamada, Shinichi Uchiyama | 2020-09-15 |
| 10777353 | Method of manufacturing electronic device and the same | Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa | 2020-09-15 |
| 10626493 | Method for producing a double-layer coated cutting tool with improved wear resistance | Denis Kurapov, Tomoya Sasaki, Shuho Koseki, Kana Morishita, Saleh Abusuilik | 2020-04-21 |