Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847411 | Conductive feature formation and structure | Pin-Wen Chen, Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Pin-Wen Chen, Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung | 2020-10-13 |
| 10535748 | Method of forming a contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2020-01-14 |