Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847411 | Conductive feature formation and structure | Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung, Ya-Yi Cheng | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung, Ya-Yi Cheng | 2020-10-13 |