Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847411 | Conductive feature formation and structure | Pin-Wen Chen, Chia-Han Lai, Min-Hsiu Hung, Ya-Yi Cheng | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Pin-Wen Chen, Chia-Han Lai, Min-Hsiu Hung, Ya-Yi Cheng | 2020-10-13 |
| 10756017 | Contact structure and method of forming | Yu-Hung Lin, Sheng-Hsuan Lin | 2020-08-25 |