Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879114 | Conductive fill | Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang, Chin-Szu Lee | 2020-12-29 |
| 10872815 | Conductive interconnect structures in integrated circuits | Shao Tzu Lien, Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang, Chin-Szu Lee | 2020-12-22 |
| 10862026 | Memory device | Szu-Ping Tung, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2020-12-08 |
| 10727118 | Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device | Pao-Sheng Chen, Pei-Hsuan Lee, Szu-Hua Wu, Chih-Chien Chi | 2020-07-28 |
| 10636702 | Conductive interconnect structures in integrated circuits | Shao Tzu Lien, Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang, Chin-Szu Lee | 2020-04-28 |
| 10533852 | Leveling sensor, load port including the same, and method of leveling a load port | Yi-Lin Wang, Chin-Szu Lee, Hua-Sheng Chiu | 2020-01-14 |
| 10535816 | Via structure, MRAM device using the via structure and method for fabricating the MRAM device | Szu-Ping Tung, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2020-01-14 |