Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879114 | Conductive fill | Jung-Tang Wu, Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang | 2020-12-29 |
| 10872815 | Conductive interconnect structures in integrated circuits | Jung-Tang Wu, Shao Tzu Lien, Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang | 2020-12-22 |
| 10763116 | Contact structure | Hong-Ying Lin, Cheng-Yi Wu, Alan Tu, Chung-Liang Cheng, Li-Hsuan Chu +6 more | 2020-09-01 |
| 10658296 | Dielectric film for semiconductor fabrication | Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more | 2020-05-19 |
| 10636702 | Conductive interconnect structures in integrated circuits | Jung-Tang Wu, Shao Tzu Lien, Chi-Hung Liao, Szu-Hua Wu, Liang-Yueh Ou Yang | 2020-04-28 |
| 10533852 | Leveling sensor, load port including the same, and method of leveling a load port | Yi-Lin Wang, Jung-Tang Wu, Hua-Sheng Chiu | 2020-01-14 |