Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10857649 | Method and apparatus for performing a polishing process in semiconductor fabrication | Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2020-12-08 |
| 10668592 | Method of planarizing a wafer | Soon-Kang Huang, Chi-Ming Yang, Chin-Hsiang Lin | 2020-06-02 |