Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816322 | Bonding apparatus and method for detecting height of bonding target | Hiromi Tomiyama | 2020-10-27 |
| 10586781 | Bonding apparatus and method of estimating position of landing point of bonding tool | Hiroya Yuzawa, Hiromi Tomiyama | 2020-03-10 |