HY

Hiroya Yuzawa

SH Shinkawa: 1 patents #3 of 17Top 20%
Overall (2020): #447,427 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10586781 Bonding apparatus and method of estimating position of landing point of bonding tool Shigeru Hayata, Hiromi Tomiyama 2020-03-10