HT

Hiromi Tomiyama

SH Shinkawa: 2 patents #1 of 17Top 6%
📍 Musashimurayama, JP: #3 of 4 inventorsTop 75%
Overall (2020): #167,664 of 565,922Top 30%
2
Patents 2020

Issued Patents 2020

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10816322 Bonding apparatus and method for detecting height of bonding target Shigeru Hayata 2020-10-27
10586781 Bonding apparatus and method of estimating position of landing point of bonding tool Shigeru Hayata, Hiroya Yuzawa 2020-03-10