Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566196 | Method for manufacturing bonded SOI wafer | Osamu Ishikawa, Kenji Meguro, Taishi WAKABAYASHI, Hiroyuki Oonishi | 2020-02-18 |
| 10529615 | Method for manufacturing a bonded SOI wafer and bonded SOI wafer | Kenji Meguro, Taishi WAKABAYASHI | 2020-01-07 |