Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808968 | Thermoacoustic cooling device | Toshiyuki Saito, Ryouichi TAKAHATA, Tomoyuki Takei | 2020-10-20 |
| 10712054 | Thermoacoustic device | Toshiyuki Saito, Ryouichi TAKAHATA, Tomoyuki Takei | 2020-07-14 |
| 10566196 | Method for manufacturing bonded SOI wafer | Norihiro Kobayashi, Kenji Meguro, Taishi WAKABAYASHI, Hiroyuki Oonishi | 2020-02-18 |