Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763127 | Heat treatment method for semiconductor wafer | Taishi WAKABAYASHI, Miho NIITANI | 2020-09-01 |
| 10566196 | Method for manufacturing bonded SOI wafer | Norihiro Kobayashi, Osamu Ishikawa, Taishi WAKABAYASHI, Hiroyuki Oonishi | 2020-02-18 |
| 10529615 | Method for manufacturing a bonded SOI wafer and bonded SOI wafer | Taishi WAKABAYASHI, Norihiro Kobayashi | 2020-01-07 |