Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Ning Ye, Tong Zhang, Hem Takiar, Yangming Liu | 2020-12-01 |
| 10818575 | Datacenter 3D solid state drives with matrix cooling | Chin-Tien Chiu, Hem Takiar | 2020-10-27 |