Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Zhongli Ji, Ning Ye, Tong Zhang, Hem Takiar | 2020-12-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Zhongli Ji, Ning Ye, Tong Zhang, Hem Takiar | 2020-12-01 |