Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Zhongli Ji, Ning Ye, Tong Zhang, Yangming Liu | 2020-12-01 |
| 10818575 | Datacenter 3D solid state drives with matrix cooling | Chin-Tien Chiu, Zhongli Ji | 2020-10-27 |
| 10811386 | Semiconductor device | Chin-Tien Chiu, Gursharan Singh, Fisher Yu, C C Liao | 2020-10-20 |
| 10734354 | Semiconductor device including optically connected wafer stack | Chin-Tien Chiu, Ye Bai, Shineng Ma, Ting-Ping Liu, Binbin Zheng +1 more | 2020-08-04 |
| 10607955 | Heterogeneous fan-out structures for memory devices | Chin-Tien Chiu, Chih-Chin Liao, Weiting Jiang | 2020-03-31 |