Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756075 | Package-on-package type semiconductor package and method for manufacturing the same | Min Gi Hong | 2020-08-25 |
| 10607905 | Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region | Baek KI, Tark-Hyun Ko, Kun-dae Yeom, Keun-Ho Jang | 2020-03-31 |