Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714401 | Printed circuit board and semiconductor package including the same | — | 2020-07-14 |
| 10607905 | Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region | Baek KI, Tark-Hyun Ko, Kun-dae Yeom, Yong Kwan Lee | 2020-03-31 |