Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607905 | Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region | Baek KI, Tark-Hyun Ko, Yong Kwan Lee, Keun-Ho Jang | 2020-03-31 |