Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863282 | MEMS package, MEMS microphone and method of manufacturing the MEMS package | Koichi Shiozawa, Jumpei Tsuchiya, Lik Hang Wan, Toyotaka Kobayashi, Hironobu Hayashi | 2020-12-08 |
| 10836630 | MEMS package and method of manufacturing the same | Toyotaka Kobayashi, Hironobu Hayashi, Ichiro Yagi, Bing Ma | 2020-11-17 |
| 10785576 | MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone | Akio Nakao | 2020-09-22 |
| 10549984 | MEMS package and method of manufacturing the same | Toyotaka Kobayashi, Hironobu Hayashi | 2020-02-04 |