Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863282 | MEMS package, MEMS microphone and method of manufacturing the MEMS package | Koichi Shiozawa, Masashi Shiraishi, Jumpei Tsuchiya, Lik Hang Wan, Toyotaka Kobayashi | 2020-12-08 |
| 10836630 | MEMS package and method of manufacturing the same | Masashi Shiraishi, Toyotaka Kobayashi, Ichiro Yagi, Bing Ma | 2020-11-17 |
| 10549984 | MEMS package and method of manufacturing the same | Masashi Shiraishi, Toyotaka Kobayashi | 2020-02-04 |