Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863282 | MEMS package, MEMS microphone and method of manufacturing the MEMS package | Koichi Shiozawa, Masashi Shiraishi, Lik Hang Wan, Toyotaka Kobayashi, Hironobu Hayashi | 2020-12-08 |