Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10845262 | Micromechanical component for a pressure sensor device | — | 2020-11-24 |
| 10836631 | Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure | Martin Rambach | 2020-11-17 |
| 10807860 | Micromechanical component for a pressure sensor device | — | 2020-10-20 |
| 10752498 | MEMS component having two different internal pressures | Achim Breitling, Eckhard Graf, Jens Frey, Mawuli Ametowobla | 2020-08-25 |
| 10730746 | Method for manufacturing a micromechanical inertial sensor | Martin Rambach | 2020-08-04 |
| 10684185 | Sensor and/or sound detection device and manufacturing method for a sensor and/or sound detection device | Daniel Haug, Holger Hoefer, Michael Knauss, Sebastian Schuler-Watkins | 2020-06-16 |
| 10647568 | Micromechanical component including diaphragm, manufacturing method for such a component and method for operating a pressure sensor | Helmut Grutzeck | 2020-05-12 |
| 10643896 | Method for producing at least one via in a wafer | Heiko Stahl, Markus Kuhnke, Stefan Majoni, Timo Schary | 2020-05-05 |
| 10584029 | Method for producing thin MEMS chips on SOI substrate and micromechanical component | Burkhard Kuhlmann, Holger Hoefer | 2020-03-10 |
| 10556789 | Laser resealing with stress-reducing prestructuring | Frank Reichenbach, Philip Kappe, Mawuli Ametowobla | 2020-02-11 |
| 10555090 | Microphone with encapsulated moving electrode | Vijaye Kumar Rajaraman, Daniel Christoph Meisel, Bernhard Gehl | 2020-02-04 |