Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Brigham NAVAJA, Houssam Jomaa | 2020-10-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Brigham NAVAJA, Houssam Jomaa | 2020-10-13 |