Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879158 | Split conductive pad for device terminal | Aniket PATIL, Hong Bok We, Zhijie Wang | 2020-12-29 |
| 10804195 | High density embedded interconnects in substrate | Marcus HSU, Brigham NAVAJA, Houssam Jomaa | 2020-10-13 |
| 10679919 | High thermal release interposer | Zhijie Wang, Bohan Yan | 2020-06-09 |
| 10651160 | Low profile integrated package | Houssam Jomaa, Christopher Bahr, Layal Rouhana | 2020-05-12 |
| 10622292 | High density interconnects in an embedded trace substrate (ETS) comprising a core layer | Houssam Jomaa | 2020-04-14 |