Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Marcus HSU, Brigham NAVAJA | 2020-10-13 |
| 10651160 | Low profile integrated package | Kuiwon Kang, Christopher Bahr, Layal Rouhana | 2020-05-12 |
| 10622292 | High density interconnects in an embedded trace substrate (ETS) comprising a core layer | Kuiwon Kang | 2020-04-14 |