Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804179 | Wafer-level package with enhanced performance | Julio C. Costa, Jan Edward Vandemeer, Jonathan Hale Hammond, Jon Chadwick | 2020-10-13 |
| 10804246 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2020-10-13 |
| 10773952 | Wafer-level package with enhanced performance | Julio C. Costa, Jon Chadwick, David Jandzinski, Jonathan Hale Hammond | 2020-09-15 |
| 10755992 | Wafer-level packaging for enhanced performance | Julio C. Costa, Peter V. Wright, Jon Chadwick | 2020-08-25 |