Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804246 | Microelectronics package with vertically stacked dies | Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim, Baker Scott +2 more | 2020-10-13 |
| 10804179 | Wafer-level package with enhanced performance | Jan Edward Vandemeer, Jonathan Hale Hammond, Merrill Albert Hatcher, Jr., Jon Chadwick | 2020-10-13 |
| 10790216 | Thermally enhanced semiconductor package and process for making the same | Robert Aigner | 2020-09-29 |
| 10784149 | Air-cavity module with enhanced device isolation | George Maxim, Dirk Robert Walter Leipold, Baker Scott | 2020-09-22 |
| 10784233 | Microelectronics package with self-aligned stacked-die assembly | George Maxim | 2020-09-22 |
| 10773952 | Wafer-level package with enhanced performance | Jon Chadwick, David Jandzinski, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond | 2020-09-15 |
| 10770802 | Antenna on a device assembly | Alexander Wayne Hietala | 2020-09-08 |
| 10759660 | Method for processing product wafers using carrier substrates | Jonathan Hale Hammond, Jan Edward Vandemeer | 2020-09-01 |
| 10755992 | Wafer-level packaging for enhanced performance | Merrill Albert Hatcher, Jr., Peter V. Wright, Jon Chadwick | 2020-08-25 |
| 10749518 | Stacked field-effect transistor switch | George Maxim, Dirk Robert Walter Leipold, Marcus Granger-Jones, Baker Scott | 2020-08-18 |
| 10622309 | Transmission line structure with high Q factor and low insertion loss for millimeter wave applications | George Maxim, Dirk Robert Walter Leipold, Baker Scott, Danny Chang | 2020-04-14 |