Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804179 | Wafer-level package with enhanced performance | Julio C. Costa, Jan Edward Vandemeer, Jonathan Hale Hammond, Merrill Albert Hatcher, Jr. | 2020-10-13 |
| 10804246 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2020-10-13 |
| 10773952 | Wafer-level package with enhanced performance | Julio C. Costa, David Jandzinski, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond | 2020-09-15 |
| 10755992 | Wafer-level packaging for enhanced performance | Julio C. Costa, Merrill Albert Hatcher, Jr., Peter V. Wright | 2020-08-25 |