Simone Comensoli — 3 Patents at Pdf Solutions

Issued Patents 2020

Showing 1–3 of 3 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10854522	Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas	Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more	2020-12-01	$4,373,000
10777472	IC with test structures embedded within a contiguous standard cell area	Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more	2020-09-15	$3,826,000
10593604	Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells	Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more	2020-03-17	$2,112,000