Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854522 | Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2020-12-01 |
| 10777472 | IC with test structures embedded within a contiguous standard cell area | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2020-09-15 |
| 10643735 | Passive array test structure for cross-point memory characterization | Tomasz Brozek, Christopher Hess, Meindert Martin Lunenborg, Hendrik Schneider, Yuan Yu +2 more | 2020-05-05 |
| 10593604 | Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2020-03-17 |