Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10708480 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2020-07-07 |
| 10666847 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2020-05-26 |
| 10659664 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2020-05-19 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2020-03-03 |