Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804305 | Manufacture of semiconductor module with dual molding | Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao, Feifan Chen +1 more | 2020-10-13 |
| 10770494 | Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal | Lifeng YAO, Bojie Zhao, Zhewen Mei | 2020-09-08 |
| 10750071 | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2020-08-18 |
| 10742859 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, ZHONG-DAN DENG | 2020-08-11 |
| 10741594 | Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal | Lifeng YAO, Bojie Zhao, Zhewen Mei | 2020-08-11 |
| 10735637 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2020-08-04 |
| 10719146 | Input device with plurality of touch pads for vehicles | — | 2020-07-21 |
| 10708480 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Zilong Deng | 2020-07-07 |
| 10670946 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Nan Guo, Zhen Huang, Duanliang Cheng +4 more | 2020-06-02 |
| 10666847 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Zilong Deng | 2020-05-26 |
| 10659664 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Zilong Deng | 2020-05-19 |
| 10630876 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Zhen Huang +4 more | 2020-04-21 |
| 10578837 | Molded photosensitive assembly for array imaging module for electronic device | Mingzhu Wang, Bojie Zhao, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2020-03-03 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2020-03-03 |