Issued Patents 2020
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10827103 | Fixed-focus camera module and manufacturing method therefor | Mingzhu Wang, Xiaojuan Su, Bojie Zhao | 2020-11-03 |
| 10806430 | Probe transmission device | Ming Tang, Leyun Bai | 2020-10-20 |
| 10804305 | Manufacture of semiconductor module with dual molding | Mingzhu Wang, Nan Guo, Bojie Zhao, Takehiko Tanaka, Feifan Chen +1 more | 2020-10-13 |
| 10781136 | Glass with single reinforced layer and preparation method thereof | Wei Hu, Fanghua Chen | 2020-09-22 |
| 10771666 | Image capturing module and electrical support thereof | Mingzhu Wang, Baozhong ZHANG, Zhen Huang, Feifan Chen, Nan Guo +1 more | 2020-09-08 |
| 10742859 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, ZHONG-DAN DENG | 2020-08-11 |
| 10708480 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2020-07-07 |
| 10701255 | Photographing module and electric bracket thereof | Mingzhu Wang, Baozhong ZHANG, Zhen Huang, Heng Jiang | 2020-06-30 |
| 10670946 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2020-06-02 |
| 10666847 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2020-05-26 |
| 10659664 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2020-05-19 |
| 10630876 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2020-04-21 |
| 10618841 | On-line method for stabilizing surface compressive stress of chemically-tempered glass | Wei Hu, Baoquan Tan, Fanghua Chen, Jianbin Feng | 2020-04-14 |
| 10575820 | Ultrasonic transducer | Kang SI, Fei Wu | 2020-03-03 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2020-03-03 |
| 10578837 | Molded photosensitive assembly for array imaging module for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2020-03-03 |
| 10564385 | MEMS device for lens barrel positioning | Nyok Boon Chong, Cheng Yi Lim, Gih Keong Lau, Chuangui Zhu | 2020-02-18 |
| 10561399 | Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof | Ming Tang | 2020-02-18 |