Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10578837 | Molded photosensitive assembly for array imaging module for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2020-03-03 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2020-03-03 |