Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10791626 | Prepreg, metal foil-clad laminate, and printed wiring board | Tomoki Hamajima, Meguru Ito, Eisuke Shiga | 2020-09-29 |
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Syunsuke Hirano, Takaaki Ogashiwa, Kazuaki KAWASHITA, Youichi Nakajima | 2020-07-28 |