Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10869390 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Nobuyoshi Ohnishi, Yoichi Takano, Tomo Chiba, Meguru Ito | 2020-12-15 |
| 10815349 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Tomoki Hamajima, Shohei Yamaguchi, Meguru Ito | 2020-10-27 |
| 10791626 | Prepreg, metal foil-clad laminate, and printed wiring board | Tomoki Hamajima, Meguru Ito, Yoshihiro Kato | 2020-09-29 |
| 10717837 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same | Katsuya Tomizawa, Meguru Ito, Tomo Chiba | 2020-07-21 |
| 10721817 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Nobuyoshi Ohnishi, Hiroshi Takahashi | 2020-07-21 |
| 10703874 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them | Yoichi Takano, Nobuyoshi Ohnishi, Katsuya Tomizawa, Naoki KASHIMA, Hiroshi Takahashi | 2020-07-07 |
| 10676579 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Yoichi Takano, Meguru Ito | 2020-06-09 |
| 10563029 | Resin composition and prepreg, resin sheet, laminate, and printed circuit board | Yoichi Takano, Katsuya Tomizawa, Takashi Kubo, Tomo Chiba | 2020-02-18 |
| 10550228 | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board | Naoki KASHIMA, Katsuya Tomizawa, Meguru Ito, Tomoki Hamajima, Kentaro Takano +1 more | 2020-02-04 |