Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727081 | Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate | Syunsuke Hirano, Yoshihiro Kato, Kazuaki KAWASHITA, Youichi Nakajima | 2020-07-28 |
| 10674609 | Entry sheet for drilling | Yousuke Matsuyama | 2020-06-02 |