Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Hongqi Li, Anurag Jindal, Gowrisankar Damarla, Shyam Ramalingam | 2020-11-24 |
| 10567387 | Systems and methods for managing computing device access to local area computer networks | Charles Trinh, Hilario Acevedo, Marco Alvarado | 2020-02-18 |
| 10567962 | Systems and methods for connecting internet-connected devices to wireless access points | — | 2020-02-18 |
| 10546777 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2020-01-28 |