Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Hongqi Li, Anurag Jindal, Jin Lu, Shyam Ramalingam | 2020-11-24 |
| 10600682 | Semiconductor devices including a stair step structure, and related methods | John B. Matovu, David S. Meyaard, Sri Sai Sivakumar Vegunta, Kunal Shrotri, Shashank Saraf +7 more | 2020-03-24 |