Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Hongqi Li, Jin Lu, Gowrisankar Damarla, Shyam Ramalingam | 2020-11-24 |
| 10546777 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Jin Lu, Shyam Ramalingam | 2020-01-28 |